技术简报
薛德明,宋德政,柳晓英.用电渗析和离子交换相结合的方法处理印制电路板氯化铜废水[J].环境科学学报,1988,8(1):116-120
用电渗析和离子交换相结合的方法处理印制电路板氯化铜废水
- REMOVAL OF COPPER FROM ETCHING PROCESSEFFLUENT BY A COMBINED PROCESS OFELECTRODIALYSIS AND ION EXCHANGE
- 摘要:据统计,我国有近千家生产印制电路板的工厂。在生产过程中,大量被刻蚀下来的铜离子随废水排放。一个年产20万m2电路板的小型工厂,一年内就要排放掉近30t铜。这不仅浪费了铜,而且严重地污染了环境。因此,治理刻蚀工艺含铜废水具有现实意义。 传统的中和沉淀法处理刻蚀工艺含铜废水投资高、占地面积大、耗用大量化学试剂;该法处理过的水含盐量(尤其C1-)高,不能直接回用。
- Abstract:Copper in effluent from an etching process was removed by a combined process of electrodialysis and ion exchange. The closed system made the treated water(less than 1mg/L Cu) reuseable and provided a way of recovering the metallic copper by using replacement reaction with scrap iron. The system was operated smooth without deposition of copper on the cathode or the ion exchange membrane. The escape of chlorine gasfrom the anode chamber was provented. The energy consumption was less than 3kWh per cubic meter wastewater treated and the cost for metallic copper recovery was about 1 yuan per kilogram.
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